Share:
The rumour mill’s latest Qualcomm produce is that the company has finally overcome its Snapdragon 810 issues.
A Chinese analyst (via GForGames) with links to TSMC – Qualcomm’s chip manufacturer – reckons Qualcomm has resolved overheating issues that allegedly plagued the flagship chip.
The newly ‘fixed’ chip will enter mass-production in mid-March, around the time we’re expecting to see an influx of flagship smartphones carrying the chip.
Talk of overheating issues emerged last year, leading to rumours of big delays in this year’s Snapdragon-carrying handsets.
It’s speculated that these issues led to Samsung binning the Snapdragon 810 on its upcoming Samsung Galaxy S6, instead opting for its own custom-built Exynos chip series.
The Snapdragon 810 is an octa-core chip laid out in ARM’s big.LITTLE configuration.
That means that four of the cores are low-power Cortex-A53, whilst the remaining four Cortex-A57 cores handle demanding tasks.
Reports suggest that the issue lay with the Cotex-A57 cores, which apparently overheated when the clock-rate went above 1.2-1.4GHz.
Related: ARM Cortex-A72: Performance, specs, and what it means for the future
LG was the first major manufacturer to out a handset carrying the chip, unveiling its G Flex 2 last month.
Unfortunately, it now seems likely that the original LG G Flex 2 will carry a different chip to the new one expected to land in other handsets.
It’s not yet clear whether this is definitely the case, but the LG G Flex 2 is likely already in production, and so it seems quite late in the game to include the fixed Snapdragon 810 in the smartphone.
Despite talk of overheating, LG has remained resolute that it will take no legal action against Qualcomm, and has had no difficulty getting the Snapdragon 810 to perform for the LG G Flex 2.